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Celebrating 50 Years of SPICE! 1973-2023
SPICE 50th Anniversary
MWSCAS 2023
Home
Organizing Committee
Symposium History
IEEE Policies
Contact information
SPICE is 50!
Program
Proceedings
Prenote & Keynotes
Tutorials
Welcome Reception
Conference Opening
DEI Event: Spilling the Tea
Education Panel: Workforce Development for Computer Engineering in the CHIP
Conference Awards
Farewell Reception
Virtual Program
Logistics
Register
Venue
Whova conference app
Tours
Casual Dress
Meeting Rooms
Instructions for Session Chairs
Virtual Speaker Submissions
Complimentary Parking
CHIPS Workshop
Authors
Oral Presentation Guidelines
Poster Presentation Guidelines
Visa Information
Call for Contributions
Call For Papers
Call For Special Sessions
Call For Tutorials
Call for CAS Transactions Papers
Submission Information
Key Dates
PaperCept tips
Tracks
Student Program
Student Research Forum
Career Fair
Young Professionals Panel
Student Participation Awards
Best Student Paper Contest
Sponsors
Sponsorship Opportunities
Exhibitor Information
Career Fair Participation Information (for Companies)
MWSCAS 2023
Home
Organizing Committee
Symposium History
IEEE Policies
Contact information
SPICE is 50!
Program
Proceedings
Prenote & Keynotes
Tutorials
Welcome Reception
Conference Opening
DEI Event: Spilling the Tea
Education Panel: Workforce Development for Computer Engineering in the CHIP
Conference Awards
Farewell Reception
Virtual Program
Logistics
Register
Venue
Whova conference app
Tours
Casual Dress
Meeting Rooms
Instructions for Session Chairs
Virtual Speaker Submissions
Complimentary Parking
CHIPS Workshop
Authors
Oral Presentation Guidelines
Poster Presentation Guidelines
Visa Information
Call for Contributions
Call For Papers
Call For Special Sessions
Call For Tutorials
Call for CAS Transactions Papers
Submission Information
Key Dates
PaperCept tips
Tracks
Student Program
Student Research Forum
Career Fair
Young Professionals Panel
Student Participation Awards
Best Student Paper Contest
Sponsors
Sponsorship Opportunities
Exhibitor Information
Career Fair Participation Information (for Companies)
More
Home
Organizing Committee
Symposium History
IEEE Policies
Contact information
SPICE is 50!
Program
Proceedings
Prenote & Keynotes
Tutorials
Welcome Reception
Conference Opening
DEI Event: Spilling the Tea
Education Panel: Workforce Development for Computer Engineering in the CHIP
Conference Awards
Farewell Reception
Virtual Program
Logistics
Register
Venue
Whova conference app
Tours
Casual Dress
Meeting Rooms
Instructions for Session Chairs
Virtual Speaker Submissions
Complimentary Parking
CHIPS Workshop
Authors
Oral Presentation Guidelines
Poster Presentation Guidelines
Visa Information
Call for Contributions
Call For Papers
Call For Special Sessions
Call For Tutorials
Call for CAS Transactions Papers
Submission Information
Key Dates
PaperCept tips
Tracks
Student Program
Student Research Forum
Career Fair
Young Professionals Panel
Student Participation Awards
Best Student Paper Contest
Sponsors
Sponsorship Opportunities
Exhibitor Information
Career Fair Participation Information (for Companies)
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